• All sections
  • H - Electricity
  • H01L - Semiconductor devices not covered by class
  • H01L 21/784 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being a semiconductor body

Patent holdings for IPC class H01L 21/784

Total number of patents in this class: 125

10-year publication summary

13
7
13
5
15
9
7
8
21
4
2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

Principal owners for this class

Owner
All patents
This class
Taiwan Semiconductor Manufacturing Company, Ltd.
36809
20
Infineon Technologies AG
8189
8
Denso Corporation
23338
5
Semiconductor Components Industries, L.L.C.
5345
5
Toyota Motor Corporation
28582
4
Texas Instruments Incorporated
19376
4
Infineon Technologies Austria AG
1954
4
MIRISE Technologies Corporation
190
4
Samsung Electronics Co., Ltd.
131630
3
Toshiba Corporation
12017
3
Intel Corporation
45621
3
United Microelectronics Corp.
3921
3
Rohm Co., Ltd.
5843
3
Hamamatsu Photonics K.K.
4161
3
Disco Corporation
1745
3
STATS ChipPAC Pte. Lte.
1516
3
Xintec Inc.
265
3
Toshiba Electronic Devices & Storage Corporation
1602
3
Murata Manufacturing Co., Ltd.
22355
2
Epistar Corporation
1553
2
Other owners 37